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Title:
【発明の名称】半導体装置及び製造方法
Document Type and Number:
Japanese Patent JP3072753
Kind Code:
B2
Inventors:
Yasuo Hasegawa
Shinichi Shinohara
Hideo Kobayashi
Application Number:
JP19722994A
Publication Date:
August 07, 2000
Filing Date:
July 29, 1994
Export Citation:
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Assignee:
Origin Electric Co., Ltd.
International Classes:
H01L29/872; H01L29/47; H01L29/861; (IPC1-7): H01L29/861; H01L29/872
Domestic Patent References:
JP5833875A
JP58131736A
JP6334630B2
JP6502277A



 
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