Title:
【発明の名称】半導体パッケージ設計仕様複合解析システム
Document Type and Number:
Japanese Patent JP3075786
Kind Code:
B2
Abstract:
PURPOSE:To optimize the design specification value of a product based on analysis obtained from two or more kinds of different points of view and global judgement from evaluation results. CONSTITUTION:A product design system is composed by providing a data input processing part 21 for which product specification and evaluation items are inputted, a program storage control part 22 which manages analysis program groups, an analysis execution control part 24 which executes the analysis program and obtains the analysis result at every evaluation item, an analysis result storage control part 26 which stores and manages the result, an evaluation part 28 which finds a design value to maximize an evaluation equation from the analysis result, and a result display processing part 30 on which the evaluation result is displayed.
Inventors:
Kazuhiro Sugino
Shingo Akasaka
Hiroko Imanishi
Junichi Saeki
Kunihiko Nishi
Asao Nishimura
Shingo Akasaka
Hiroko Imanishi
Junichi Saeki
Kunihiko Nishi
Asao Nishimura
Application Number:
JP22048091A
Publication Date:
August 14, 2000
Filing Date:
August 30, 1991
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
G06F17/50; (IPC1-7): G06F17/50
Other References:
工業調査会発行 天野修訳「射出成形用ＣＡＥ」３０−６５頁
Attorney, Agent or Firm:
Kazuko Tomita