Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3077638
Kind Code:
B2
Inventors:
Yutaka Ueda
Application Number:
JP20943897A
Publication Date:
August 14, 2000
Filing Date:
August 04, 1997
Export Citation:
Assignee:
NEC
International Classes:
H01L29/417; H01L21/225; H01L21/331; H01L29/73; H01L29/732; (IPC1-7): H01L21/331; H01L21/225; H01L29/73
Domestic Patent References:
| JP61208872A | ||||
| JP327532A | ||||
| JP1216575A | ||||
| JP7235547A |
Attorney, Agent or Firm:
Nobuo Takahashi (3 outside)