Title:
【発明の名称】バンプ形成装置およびバンプ形成方法
Document Type and Number:
Japanese Patent JP3082657
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a bump formation device wherein a ball of a lower end part of a wire is firmly bonded to an electrode of a work and a lower surface of a ball (bump) is not damaged, and a bump formation method. SOLUTION: After a ball 14 is formed by making a torch 36 get near a lower end part of a wire 13 which is led out of a capillary tool 12, the capillary tool 12 is lowered and the ball 14 is made to bite into a lower end part of a central hole of the capillary tool 12. Then, the wire 13 is firmly clasped by a cut clamper 28, the capillary tool 12 is lowered and the wire 13 is cut. The capillary tool 12 is further lowered and bonding is performed by pressing the ball 14 to an electrode 10a of a chip 10. After the capillary tool 12 is raised, a tension clamper 26 is lowered for leading the wire 13 out of a lower end part of the capillary tool 12.
Inventors:
Waki Eisuke
Go Takada
Go Takada
Application Number:
JP2227796A
Publication Date:
August 28, 2000
Filing Date:
February 08, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/60; H01L21/60
Domestic Patent References:
| JP63296248A | ||||
| JP653221A | ||||
| JP4171826A | ||||
| JP574779A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)