Title:
【発明の名称】半導体装置の製法およびそれに用いる封止用ペレット
Document Type and Number:
Japanese Patent JP3121020
Kind Code:
B2
Abstract:
PCT No. PCT/JP96/00523 Sec. 371 Date Nov. 7, 1996 Sec. 102(e) Date Nov. 7, 1996 PCT Filed Mar. 5, 1996 PCT Pub. No. WO96/27900 PCT Pub. Date Sep. 12, 1996A method of production of a semiconductor device such as a plastic pin grid array (PPGA) and a plastic ball grid array (PBGA) having a cavity-fill form. In this method, first, a semiconductor element (3) is placed in a cavity (6) formed in a multiple step-like substrate (2). Under this state, a pellet (7), which is in a solid state at a normal temperature, made of an encapsulating resin composition containing specific components, and has specific characteristics, is placed on the semiconductor element (3). Next, the semiconductor device is heated so that the pellet can melt to fill the cavity (6) with the composition, thereby encapsulating the semiconductor device (3). According to the present invention, a semiconductor device having low stress performance and excellent moisture-proof reliability can be efficiently produced.
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Inventors:
Makoto Kuwamura
Kazuhiro Ikemura
Shinya Akizuki
Takashi Fukushima
Shinichiro Shuto
Tatsushi Ito
Kazuhiro Ikemura
Shinya Akizuki
Takashi Fukushima
Shinichiro Shuto
Tatsushi Ito
Application Number:
JP51750096A
Publication Date:
December 25, 2000
Filing Date:
March 05, 1996
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/54; H01L23/13; H01L23/24; (IPC1-7): H01L21/56; C08G59/62; H01L23/28
Domestic Patent References:
| JP63110645A | ||||
| JP567703A | ||||
| JP4303953A | ||||
| JP2209949A | ||||
| JP63164237U |
Attorney, Agent or Firm:
Yukihiko Saitou