【発明の名称】光信号モジュール

Japanese Patent JP3123760

B2

PURPOSE:To reduce the size of an optical signal module by a method wherein the module is provided with two lead frames, which are respectively arranged on two layers and are a lead frame for optical semiconductor mounting use and a lead frame for mounting a semiconductor chip constituting a peripheral circuit. CONSTITUTION:Two lead frames 6 and 7 are respectively arranged on two upper and lower layers, an optical semiconductor element 1, such as a light- emitting diode, a photodetecting diode or the like, is mounted on the upper side lead frame 6, a semiconductor chip 2, which is an integrated circuit constituting a peripheral circuit, such as a drive circuit, a photodetecting signal processing circuit or the like, is mounted on the lower side lead frame 7 and after being electrically connected to each other via bonding wires 5, the lead frames are encapsulated in a case 3 which is a transparent resin mold. Thereby, a reduction in the size of an optical signal module becomes possible and at the same time, the erroneous operation of the module, which is caused by an effect to the peripheral circuit due to an optical signal of the element 1, can be suppressed.

JPH09172141	PREPARATION OF SEMICONDUCTOR MODULE FOR ELECTRIC POWER
JPH0266966	INTEGRATED SENSING ELEMENT
WO/2001/033641	SEMICONDUCTOR LIGHT-EMITTING DEVICE

Yoshiyuki Wada
Kazunori Yuzuhara

JP1046091A

January 15, 2001

January 31, 1991

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NEC
Kyushu Electronics Co., Ltd.

H01L25/16; H01L27/00; H01L31/02; H01L33/62; (IPC1-7): H01L33/00; H01L25/16; H01L27/00; H01L31/02

JP6333886A
JP6070783A
JP1147853A
JP1120342U
JP61100155U
JP58173255U

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