Title:
【発明の名称】高弾性係数支持材付き圧力センサ
Document Type and Number:
Japanese Patent JP3124773
Kind Code:
B2
Abstract:
A metal thin film bonds a semiconductor bonding region of a diaphragm layer to a ceramic bonding region of a high modulus support block. The arrangement isolates a pressure sensing diaphragm from undesired strain, improving sensor accuracy. A passageway through the support block couples the fluid pressure to the sensing diaphragm to deflect it. Capacitive coupling between the diaphragm and a capacitor plate on the support block sense the deflection and provide an output representative of pressure.
Inventors:
Broden, David A.
Bischoff, Brian Jay.
Lowagi, Bennett El.
Bischoff, Brian Jay.
Lowagi, Bennett El.
Application Number:
JP50884792A
Publication Date:
January 15, 2001
Filing Date:
March 24, 1992
Export Citation:
Assignee:
Rosemount Incorporated
International Classes:
G01L9/00; G01L9/12; G01L13/00; G01L7/08; (IPC1-7): G01L9/12; G01L7/08; G01L13/00
Domestic Patent References:
| JP420830A | ||||
| JP144823A | ||||
| JP199036U | ||||
| JP1503084A |
Other References:
【文献】米国特許5157972(US,A)
Attorney, Agent or Firm:
Michito Hiraki (1 person outside)
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