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Title:
【発明の名称】バーンイン試験用ボード
Document Type and Number:
Japanese Patent JP3128442
Kind Code:
B2
Abstract:
PURPOSE: To enable burn-in testing of multiple kinds of semiconductor devices to be conducted through a connection altering work of a wire member separated from a substrate by mounting an electrical part to be tested on the substrate and connecting one end of the wire member composed separately from the substrate a to a part side contact section. CONSTITUTION: An electric part to be tested is mounted on a substrate 1, one ends of wire members 25 and 26 composed separately from the substrate 1 is connected to a part side contact part 20 and the other ends of the wire members 25 an 26 are connected to any ones of a plurality of contact parts 21 and 22 on the side of a contact plug according to the part to be tested and the contact plug of the substrate 1 is connected to a contact plug of a burn-in tester. The substrate 1 is arranged in a heating tank of the tester and the electric part to be tested is placed in a high temperature environment accompanying heating operation of the heating tank to supply electric test conditions such as voltage, current and signals to the electric part to be tested according to the type of the electric part to be tested through the contact plug of the substrate 1 from the contact plug of the burn-in tester. Thus, a burn-in testing of the electric part to be tested is performed.

Inventors:
Okumura Shoji
Yoshitake Miyagawa
Application Number:
JP22301394A
Publication Date:
January 29, 2001
Filing Date:
September 19, 1994
Export Citation:
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Assignee:
Risho Industry Co., Ltd.
Mitsubishi Electric Corporation
International Classes:
G01R31/28; H01L21/66; G01R31/26; (IPC1-7): G01R31/26; H01L21/66
Domestic Patent References:
JP587876A
JP63155629A
JP625775U
JP545579U
JP399438U
Attorney, Agent or Firm:
Junichi Miyazono



 
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