Title:
【発明の名称】半導体ウエハ用バスケット
Document Type and Number:
Japanese Patent JP3130067
Kind Code:
B2
Inventors:
Takemi Kakizaki
Application Number:
JP6235791A
Publication Date:
January 31, 2001
Filing Date:
March 05, 1991
Export Citation:
Assignee:
Kakizaki Manufacturing Co., Ltd.
International Classes:
H01L21/304; H01L21/306; H01L21/673; H01L21/68; (IPC1-7): H01L21/68; H01L21/304; H01L21/306
Domestic Patent References:
| JP57141927A | ||||
| JP278246A | ||||
| JP497346U | ||||
| JP390446U | ||||
| JP292931U |
Attorney, Agent or Firm:
Youichi Ohshima
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