Title:
半導体発光装置及び半導体発光装置を用いた面状発光源
Document Type and Number:
Japanese Patent JP3138795
Kind Code:
U
Abstract:
A semiconductor light emitting device includes: a base portion having a concave portion formed in one of major surfaces thereof; and a light emitting element mounted on a bottom surface of the concave portion of the base portion. The base portion comprises a side wall portion that surrounds the light emitting element. The light emitting element is covered with a resin portion filled in the concave portion. At least a part of an upper surface of the resin portion is positioned closer to the bottom surface of the concave portion than an upper surface of the side wall portion.
Inventors:
Takeshi Sano
Koji Tsukagoshi
Masaki Hoshino
Koji Tsukagoshi
Masaki Hoshino
Application Number:
JP2007008501U
Publication Date:
January 17, 2008
Filing Date:
November 02, 2007
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
H01L23/28; H01L33/54; H01L33/48