Title:
リードフレームおよび半導体装置
Document Type and Number:
Japanese Patent JP3146207
Kind Code:
U
Inventors:
Riken Sword
Application Number:
JP2008006020U
Publication Date:
November 06, 2008
Filing Date:
August 27, 2008
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
H01L23/48
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