Title:
補強シリコン製マイクロメカニカル部品の製造方法
Document Type and Number:
Japanese Patent JP3183864
Kind Code:
U
Abstract:
The method involves micromachining a micromechanical part with a silicon core (1), or a batch of parts in a silicon wafer. A layer of silicon dioxide is formed over the entire surface of the part in one step or different steps by thermal oxidation of the surface at a temperature ranging between 900 to 1200 degree Celsius, to obtain a silicon dioxide thickness that is five times greater than a thickness of native silicon dioxide. The layer is removed by chemical attack. A coating in a material having tribological properties higher than that of crystalline silicon is formed on the surface.
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Inventors:
Calapatis, Nakis
Application Number:
JP2013000930U
Publication Date:
June 06, 2013
Filing Date:
February 21, 2013
Export Citation:
Assignee:
Monterey Breguet SA
International Classes:
G04B13/02; G04B15/14
Attorney, Agent or Firm:
Hirofumi Mimata