Title:
半導体装置等の電子部品の収納容器
Document Type and Number:
Japanese Patent JP3183961
Kind Code:
U
Inventors:
Hiroyuki Harada
Tsugusei Keda
Tsugusei Keda
Application Number:
JP2013001708U
Publication Date:
June 06, 2013
Filing Date:
March 28, 2013
Export Citation:
Assignee:
Kaneda Corporation
International Classes:
B65D85/86
Attorney, Agent or Firm:
Osamu Akiyama