Title:
【発明の名称】半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP3338756
Kind Code:
B2
Inventors:
Naoki Makita
Application Number:
JP34916596A
Publication Date:
October 28, 2002
Filing Date:
December 27, 1996
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/20; H01L21/336; H01L29/786; (IPC1-7): H01L21/336; H01L21/20; H01L29/786
Domestic Patent References:
| JP7626766A | ||||
| JP799323A | ||||
| JP869967A | ||||
| JP7335904A | ||||
| JP6132304A | ||||
| JP5196962A | ||||
| JP7183535A |
Attorney, Agent or Firm:
Takaya Koike