【発明の名称】半導体集積回路装置の製造方法および半導体集積回路装置

Title:

【発明の名称】半導体集積回路装置の製造方法および半導体集積回路装置

Document Type and Number:

Japanese Patent JP3357456

Kind Code:

B2

Inventors:

Mika Kajita
Masayoshi Yoshida
Hisayuki Kato
Norio Suzuki

Application Number:

JP9826894A

Publication Date:

December 16, 2002

Filing Date:

May 12, 1994

Export Citation:

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Assignee:

株式会社日立製作所

International Classes:

C23C16/44; H01L21/205; H01L21/28; H01L21/3205; H01L23/52; H01L29/78; (IPC1-7): H01L21/28; C23C16/44; H01L21/205; H01L21/3205; H01L29/78

Domestic Patent References:

JP4150017A
JP7283411A

Attorney, Agent or Firm:

Yamato Tsutsui

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