Title:
【発明の名称】半導体製造用加熱装置
Document Type and Number:
Japanese Patent JP3359324
Kind Code:
B2
Abstract:
The present invention relates to a semiconductor manufacturing furnace having a heat blocker mounted to an elevating plate of the furnace. The heat blocker prevents the internal temperature of the furnace from decreasing radically when a wafer boat is lowered from the processing chamber of the furnace by the elevating plate. The heat blocker includes a sealed case, a plurality of horizontally extending heat-reflecting plates disposed in the case, and a plurality of support pins for supporting and fixing the reflecting plates in place. The heat-reflecting plates reflect heat back up into the processing chamber, as the elevating plate lowers the wafer boat, to keep the internal temperature of the heater stable. This not only enhances the productivity of the manufacturing process but also enhances the uniformity of the processed wafers.
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Inventors:
Ahn Jaehyun
Changshu Yang
Awaji
Han Ken
Changshu Yang
Awaji
Han Ken
Application Number:
JP2000283319A
Publication Date:
December 24, 2002
Filing Date:
September 19, 2000
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
C23C16/46; C30B25/10; C23C16/44; H01L21/205; H01L21/22; (IPC1-7): H01L21/205; H01L21/22
Domestic Patent References:
| JP9306855A | ||||
| JP6208954A | ||||
| JP5343342A |
Attorney, Agent or Firm:
Masaki Hattori