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Title:
【発明の名称】光モジュール
Document Type and Number:
Japanese Patent JP3359517
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a module that is not only high in coupling efficiency and reliability but also easy to produce with a simple structure, by forming a ferrule and/or a sleeve for leading out an optical fiber integrally with a package from ceramics. SOLUTION: Inside the package to be airtightly sealed by a main body 10 of package and a lid member 17, a silicon substrate 20 having a V groove 21 is arranged. Then, an optical fiber 31 photocoupled with a photoelectric transducer 24 on the silicon substrate 20 is led outside and a lead pin 16 forming an external lead and the photoelectric transducer 24 are electrically connected. In this case, the main body 10 of package is composed of ceramics and box- shaped while opening its upper part, a ferrule 11 having a through hole 12 is integrally formed on its side face, a step part 14 is provided on its inner peripheral surface, and the lead pin 16 is inserted and fixed into a through hole 15 formed at the step part 14. The lead pin 16 is fixed completely through the inside and outside, and an outside flange part forms the external lead.

Inventors:
Mikio Kyomasu
Application Number:
JP33430196A
Publication Date:
December 24, 2002
Filing Date:
December 13, 1996
Export Citation:
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Assignee:
Kyocera Corporation
International Classes:
G02B6/42; H01L31/0232; H01L33/48; (IPC1-7): G02B6/42
Domestic Patent References:
JP792335A
JP6163869A
JP5758370A
JP659164A



 
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