Title:
【発明の名称】マイクロシステム及びマイクロシステムを製造する方法
Document Type and Number:
Japanese Patent JP3359910
Kind Code:
B2
Abstract:
A microsystem comprises a flexible foil, a plurality of semiconductor elements embedded in said flexible foil, and a connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements. For producing the microsystem, electronic components are first integrated in a semiconductor layer provided on a wafer. Subsequently, the semiconductor areas which are not required between the electronic components are etched away, whereupon the flexible foil is applied. A connection line is then applied to the flexible foil so as to interconnect the individual semiconductor elements. Finally, the semiconductor is etched away from the back so as to obtain the microsystem in the case of which the individual semiconductor elements are mechanically connected only by the flexible foil but no longer by the semiconductor substrate.
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Inventors:
Hoku Chiem Trieu
Wilfried Mokuwa
Ruth Ebe
Wilfried Mokuwa
Ruth Ebe
Application Number:
JP2000529010A
Publication Date:
December 24, 2002
Filing Date:
January 22, 1998
Export Citation:
Assignee:
Fraunhofer-Gesellschaft Tool Felderung del Angewanten Forsung Eingetler Genel Fehlein
International Classes:
H01L25/18; H01L23/52; H01L23/538; H01L25/04; H01L25/065; (IPC1-7): H01L23/52; H01L25/04; H01L25/18
Domestic Patent References:
| JP5211275A | ||||
| JP4137660A | ||||
| JP9139561A | ||||
| JP635543A | ||||
| JP61234082A | ||||
| JP5110777A | ||||
| JP312450U | ||||
| JP2000514937A |
Other References:
【文献】米国特許5324687(US,A)
Attorney, Agent or Firm:
Shigeo Noguchi