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Title:
【発明の名称】半導体装置の作製方法
Document Type and Number:
Japanese Patent JP3361314
Kind Code:
B2
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Inventors:
Shunpei Yamazaki
Yasuhiko Takemura
Application Number:
JP2000191506A
Publication Date:
January 07, 2003
Filing Date:
June 26, 2000
Export Citation:
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Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L21/20; H01L21/336; H01L29/786; (IPC1-7): H01L21/20; H01L21/336; H01L29/786
Domestic Patent References:
JP2194620A
JP281423A
Other References:
【文献】特許2923700(JP,B2)
Attorney, Agent or Firm:
Makoto Hagiwara



 
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