Title:
【発明の名称】片面樹脂封止型半導体パッケージ並びに片面樹脂封止型半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3366460
Kind Code:
B2
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Inventors:
Mitsutoshi Higashi
Application Number:
JP22331394A
Publication Date:
January 14, 2003
Filing Date:
September 19, 1994
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01L23/28; H01L21/56; H01L23/04; H01L23/10; (IPC1-7): H01L23/10; H01L21/56; H01L23/04; H01L23/28
Domestic Patent References:
| JP4111454A | ||||
| JP63193814A | ||||
| JP5433663A | ||||
| JP614234A | ||||
| JP63136333U |
Other References:
【文献】社団法人 ハイブリッドマイクロエレクトロニクス協会編,エレクトロニクス実装技術用語辞典,日本,株式会社 工業調査会,1992年1月20日,p176
Attorney, Agent or Firm:
Takao Watanuki (1 outside)