Title:
【発明の名称】半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3370183
Kind Code:
B2
Inventors:
Yoshihiko Nemoto
Application Number:
JP11537294A
Publication Date:
January 27, 2003
Filing Date:
May 27, 1994
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/52; (IPC1-7): H01L23/52
Domestic Patent References:
| JP60206058A | ||||
| JP59194460A |
Other References:
【文献】国際公開94/7267(WO,A1)
Attorney, Agent or Firm:
Toshihide Kodama (3 others)