Title:
【発明の名称】封止用エポキシ樹脂組成物および半導体装置
Document Type and Number:
Japanese Patent JP3370271
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition hardly generating a molding trouble such as a releasing trouble, maintaining a stiffness on its curing, excellent in heat resistance and close adhesion and suitable for semiconductor device, etc., by making the composition contain a specific epoxy resin, a curing agent, etc., and a prescribed amount of a specific carboxylic acid anhydride. SOLUTION: This epoxy resin composition for sealing contains (A) an epoxy resin containing at least a biphenyl type epoxy resin having a biphenyl skeleton of formula I (R<1> to R<8> are each H or a 1-5C alkyl), (B) preferably 0.7-1.0 equivalent [based on 1 equivalent component (A)] of a curing agent such as a phenolic resin of formula II or III [(n) is 1-5], (C) preferably 0.25-5 wt.% (based on the whole of the composition) of a curing accelerator such as triphenylphosphine, (D) preferably 65-90 wt.% (based on the whole of the composition) of a filler such as a fused silica as indispensable components, and further (E) 0.1-3.0 wt.% >=1 cyclic ring-containing carboxylic acid anhydride based on the total amount of the resin. Further, it is preferable to contain also an epoxy resin having a skeleton of formula IV.
Inventors:
Tatsuyoshi Wada
Masashi Nakamura
Masashi Nakamura
Application Number:
JP4077898A
Publication Date:
January 27, 2003
Filing Date:
February 23, 1998
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
C08K3/00; C08G59/62; C08G59/68; C08K5/09; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/62; C08K5/09; H01L23/29; H01L23/31
Domestic Patent References:
| JP11289034A | ||||
| JP952940A | ||||
| JP9100394A |
Attorney, Agent or Firm:
Takehiko Matsumoto