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Patent Searching and Data


Title:
【発明の名称】半導体集積回路装置
Document Type and Number:
Japanese Patent JP3372231
Kind Code:
B2
Inventors:
Atsushi Kameyama
Tsuneaki Fuse
Application Number:
JP33029899A
Publication Date:
January 27, 2003
Filing Date:
November 19, 1999
Export Citation:
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Assignee:
Toshiba Corporation
International Classes:
H02J7/00; G06F1/26; H02J1/00; (IPC1-7): G06F1/26; H02J1/00; H02J7/00
Domestic Patent References:
JP7240094A
JP3149876A
JP437162A
Attorney, Agent or Firm:
Takehiko Suzue (6 outside)