Title:
【発明の名称】周辺装置の集積回路のデータ送信機能をテスト及び表示するシミュレーション・システム
Document Type and Number:
Japanese Patent JP3380164
Kind Code:
B2
Abstract:
A system implement simulation system's capable of facilitating integrated circuit designers to perform a complete integrated circuit testing with respect to a target peripheral device and demonstrate various functions and their sequence of operations without having to build the target device physically. The system allows, reliability and quality of an integrated circuit design to be increased, and production and testing costs can be reduced. The simulation system is capable of performing functional checking at any time, and can be utilized in demonstrating product functions to customer.
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Inventors:
Zhangzi
Vermilion
Wang Shiang
Vermilion
Wang Shiang
Application Number:
JP13354898A
Publication Date:
February 24, 2003
Filing Date:
May 15, 1998
Export Citation:
Assignee:
Winbond Electronics Corp.
International Classes:
G06F11/26; G06F11/28; G06F13/00; G06F17/50; H04L69/40; G01R31/28; (IPC1-7): G06F13/00; G01R31/28; G06F11/28; H04L12/28; H04L29/14
Domestic Patent References:
| JP8328896A | ||||
| JP5143515A | ||||
| JP8114649A |
Attorney, Agent or Firm:
Kazuo Shamoto (5 outside)