Title:
【発明の名称】ウェーハ保持プラテンおよび持ち上げ手段
Document Type and Number:
Japanese Patent JP3381173
Kind Code:
B2
Abstract:
An apparatus for releasably holding a workpiece in semiconductor process systems such as a batch ion implanter which comprises a linkage mechanism mounted onto the backside of the platen for clamping the wafer against the fence of the supporting means and pusher means mounted on wafer lift means for engagement with the lever mechanism for locking and unlocking the device, and sensing any misclamp of the workpiece.
Inventors:
Freightsis, Avram
Hartell, Richard Jay
Hartell, Richard Jay
Application Number:
JP50218195A
Publication Date:
February 24, 2003
Filing Date:
June 13, 1994
Export Citation:
Assignee:
Varian Semiconductor Equipment Associates, Inc.
International Classes:
H01L21/683; H01L21/265; H01L21/687; (IPC1-7): H01L21/68; H01L21/265
Domestic Patent References:
| JP4225256A | ||||
| JP250954U | ||||
| JP541141U | ||||
| JP336135U |
Attorney, Agent or Firm:
Sumio Takeuchi (1 outside)