Title:
【発明の名称】ハイブリッド回路
Document Type and Number:
Japanese Patent JP3382677
Kind Code:
B2
Abstract:
A surface-mountable packageless hybrid (20) comprising a ceramic substrate (24) with circuit elements (26) attached to a top surface (27) of the substrate is attached to a ground pad (30) on a printed circuit board (34). A high performance transition for microwave frequency signals between the circuit board and the substrate is provided by RF connections (38) comprising three gull wing shaped leads (42-44) connecting three solder pads (46-48) on the printed circuit board to three solder pads (50-52) on the substrate, the solder pads having capacitive matching sections to compensate for lead inductance. The center lead (43) conducts the microwave frequency signal while the outer leads (42,44) are grounded.
Inventors:
Keith El Freys
Mark H Bits
Mark H Bits
Application Number:
JP20297293A
Publication Date:
March 04, 2003
Filing Date:
July 23, 1993
Export Citation:
Assignee:
AGILENT TECHNOLOGIES, INC.
International Classes:
H01L23/12; H01P5/08; H05K1/02; H05K1/14; H05K3/34; H05K3/36; (IPC1-7): H01L23/12
Domestic Patent References:
| JP2254804A | ||||
| JP61222246A | ||||
| JP2156702A | ||||
| JP62128549A |
Attorney, Agent or Firm:
Kimihisa Kato