Title:
【発明の名称】段ボールの製造
Document Type and Number:
Japanese Patent JP3385021
Kind Code:
B2
Abstract:
PCT No. PCT/AU92/00439 Sec. 371 Date Feb. 4, 1994 Sec. 102(e) Date Feb. 4, 1994 PCT Filed Aug. 18, 1992 PCT Pub. No. WO93/03913 PCT Pub. Date Mar. 4, 1993.Corrugated paperboards are prepared for corrugation and adhesive bonding of mediums and liners by exposing the mediums liners and adhesives to radiant energy from a thermal source ranging from 1100 DEG C. to 2300 DEG C. and emitting a dominant wavelength in the range of 2.1 to 1.0 microns. The speed of adhesive bond development is increased. Polymeric adhesives may be used as alternatives to conventional starch based adhesives.
Inventors:
Neil William, Shaw
Padani, Zort Victor
Frederick John, Mutima
Padani, Zort Victor
Frederick John, Mutima
Application Number:
JP50396893A
Publication Date:
March 10, 2003
Filing Date:
August 18, 1992
Export Citation:
Assignee:
Amkor Limited
International Classes:
B31F1/20; B31F1/28; (IPC1-7): B31F1/28
Domestic Patent References:
| JP3102896A | ||||
| JP1136733A |
Other References:
【文献】米国特許4589944(US,A)
【文献】英国特許出願公開2121353(GB,A)
【文献】英国特許出願公開2121353(GB,A)
Attorney, Agent or Firm:
Masaki Yamakawa (5 outside)