Title:
【発明の名称】新規な光感受性樹脂組成物
Document Type and Number:
Japanese Patent JP3507798
Kind Code:
B2
Abstract:
A positive photosensitive resin composition. The composition comprising:(a) a capped polybenzoxazole precursor polymer having the structure;wherein Ar1 is a tetravalent aromatic group, aliphatic group, heterocylic group, or mixtures thereof; Ar2 is a divalent aromatic, heterocyclic, alicyclic, or aliphatic group that optionally may contain silicon; Ar3 is divalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof;Z is one of the following groups:x is 10 to 1000; y is 0 to 900; and b is 0.10 to 350;(b) a photosensitive agent; and(c) a solvent.
Inventors:
William Dee Weber
Pamela Jay Waterson
Steve Lien-Chun Shu
Ahmad Naini
Pamela Jay Waterson
Steve Lien-Chun Shu
Ahmad Naini
Application Number:
JP2000572722A
Publication Date:
March 15, 2004
Filing Date:
September 29, 1999
Export Citation:
Assignee:
OLIN MICROELECTRONIC CHEMICALS,INC.
International Classes:
C08G73/22; C08K5/00; C08L79/04; G03F7/004; G03F7/022; G03F7/023; G03F7/075; H01L21/027; (IPC1-7): G03F7/023; C08G73/22; C08K5/00; C08L79/04; G03F7/022; H01L21/027
Domestic Patent References:
| JP11181089A | ||||
| JP7281441A | ||||
| JP7300558A | ||||
| JP822118A | ||||
| JP431862A | ||||
| JP387745A | ||||
| JP8123034A | ||||
| JP9302221A | ||||
| JP55996A |
Attorney, Agent or Firm:
Chika Takagi (2 outside)