Title:
半導体装置および半導体装置の製造方法、並びに、データキャリア装置およびデータキャリア装置の製造方法
Document Type and Number:
Japanese Patent JP3552163
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a damage due to a point pressure load of a semiconductor chip. SOLUTION: When the point pressure load 61 is applied, a stress field is generated in a hard layer 41b in an extremely short time, and an operating area is increased. Thus, the load 61 to be propagated to soft resin particles 52 of a stress dispersing layer 41a is dispersed as shown by an arrow. As a result, the load applied to the chip 11 is dispersed and transformed into a surface pressure load. Accordingly, the damage of the chip 11 is prevented.
Inventors:
Wakahiro Kawai
Application Number:
JP2000335385A
Publication Date:
August 11, 2004
Filing Date:
November 02, 2000
Export Citation:
Assignee:
OMRON Corporation
International Classes:
G06K19/07; G06K19/077; H01L21/60; H01L25/00; (IPC1-7): H01L21/60; G06K19/07; G06K19/077; H01L25/00
Domestic Patent References:
| JP11102424A | ||||
| JP2000067200A | ||||
| JP9183285A | ||||
| JP2000182016A | ||||
| JP2001109869A | ||||
| JP7089279A | ||||
| JP2000231614A | ||||
| JP11232415A |
Attorney, Agent or Firm:
Yoshio Inamoto