Title:
光半導体素子の検査装置
Document Type and Number:
Japanese Patent JP3553855
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To surely carry out positioning as to a reference surface required in inspection of a photo-semiconductor element. SOLUTION: A work 31 is supplied one by one from a work supplying mechanism 32 to be carried upto a position of a work inspecting box 34 by a work conveying mechanism 33. A work holding mechanism 35 holds the work 31 in the condition where the referential surface 36 of the work 31 has a space with respect to a referential surface 38 of provided in the holding mechanism 35 in a point of time when the work 31 is supplied from the work supplying mechanism 32 to the work conveying mechanism 33. The work holding mechanism 35 is moved along a conveying route of the work 31 by the work conveying mechanism 33, the referential surface 36 of the work 31 is pushed to be brought into close contact with the referential surface 38 of the holding mechanism 35 when passing through a sloped face of a positioning arm 37 provided midway, the positioning is finished with respect to the referential surface 36 in the stage where the work 31 is conveyed to a position of the work inspecting box 34, and the accurate inspection is carried out thereby.
Inventors:
Shoji Yonekawa
Hiroshi Kawada
Hiroshi Kawada
Application Number:
JP2000133717A
Publication Date:
August 11, 2004
Filing Date:
May 02, 2000
Export Citation:
Assignee:
Sharp Corporation
International Classes:
G01J1/00; G01J1/06; G01M11/00; G10C3/00; G10C3/26; H01L31/10; H01L33/00; (IPC1-7): G01M11/00; G01J1/00; H01L31/10; H01L33/00
Domestic Patent References:
| JP6370586A | ||||
| JP8236594A | ||||
| JP4259865A |
Attorney, Agent or Firm:
Keiichiro Saikyo