Title:
集積化バッテリマウントを有する表面装着可能集積回路パッケージ
Document Type and Number:
Japanese Patent JP3554350
Kind Code:
B2
Abstract:
An integrated circuit package of the surface-mountable type within which a battery is mounted is disclosed. Battery leads extend from the side of the package body opposite that which is adjacent the circuit board when mounted, and between which a conventional battery may be placed. Standoffs are located on the package body for supporting the battery above the package body, so that a gap is present therebetween. A housing is attached to the package over the battery, and has standoffs attached to its inner surface so that a gap is also present between the housing and the battery. The gaps may be air gaps or filled with a low thermal conductivity material. The gaps thermally insulate the battery from the package body and housing, so that the circuit may be subjected to solder reflow mounting to a circuit board, while insulating the high temperatures from the battery.
More Like This:
| JP2006215854 | SEMICONDUCTOR MEMORY SYSTEM |
| WO/2023/023052 | THROUGH WAFER TRENCH ISOLATION |
| JPS61114598 | COMPOSITE PART |
Inventors:
Day. Craig Dixon
Michael Jay Hunt
Michael Jay Hunt
Application Number:
JP31768893A
Publication Date:
August 18, 2004
Filing Date:
December 17, 1993
Export Citation:
Assignee:
STMicroelectronics,Inc
International Classes:
H01L25/00; H01L23/495; H01L23/58; H01M50/50; (IPC1-7): H01L25/00
Domestic Patent References:
| JP57109183A | ||||
| JP380561A | ||||
| JP3229451A |
Attorney, Agent or Firm:
Masaaki Kobashi