Title:
半導体封止用エポキシ樹脂組成物の製造方法
Document Type and Number:
Japanese Patent JP3560161
Kind Code:
B1
Abstract:
A method of manufacturing an epoxy resin composition for semiconductor encapsulating by use of a kneader provided with a suction hole on the downstream side of a kneading region in a conveying direction of the epoxy resin composition, and being provided with a supply orifice and a discharge orifice respectively disposed on the upstream side and the downstream side in the conveying direction of the epoxy resin composition, the method comprising kneading the epoxy resin composition, while discharging a volatile gas from the kneader through the suction hole, and simultaneously introducing outside air to the kneader through the supply orifice and the discharge orifice. Even under conditions of continuous operation of the kneader, it is possible to efficiently discharge a volatile gas, thereby significantly decreasing the quantity of a volatile components remaining in the kneaded epoxy resin composition. Therefore, when semiconductor devices are encapsulated with the epoxy resin composition, the generation of voids can be decreased.
Inventors:
Mitsuo Ishikawara
Koji Taya
Takeo Yamada
Rikiya Kobayashi
Hideki Ebihara
Koji Taya
Takeo Yamada
Rikiya Kobayashi
Hideki Ebihara
Application Number:
JP2003022571A
Publication Date:
September 02, 2004
Filing Date:
January 30, 2003
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
B29C48/395; B29B7/46; B29B7/84; B29C48/76; H01L21/56; H01L23/29; H01L23/31; B29K63/00; (IPC1-7): B29B7/84; H01L21/56
Domestic Patent References:
| JP2001081284A | ||||
| JP3320354B2 | ||||
| JP3009027B2 | ||||
| JP6293021A | ||||
| JP11170251A | ||||
| JP53132856A |
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