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Patent Searching and Data


Title:
チップカード及びチップカードの製造方法
Document Type and Number:
Japanese Patent JP3571057
Kind Code:
B2
Abstract:
A chip card for the contactless transmission of electric signals to a terminal includes a card body in which a coupling element having conductor tracks and contact connections, and a semiconductor chip having an electronic circuit associated with the coupling element, are constructed in an integrated manner. The semiconductor chip is provided on its surface with contact elements for electrical connection of the electronic circuit and the contact connections of the coupling element. A carrier made of an electrically insulating material supports at least part of the conductor tracks and the contact connections of the coupling element. The carrier is provided with an aperture in the vicinity of the contact connections of the coupling element, for receiving the semiconductor chip.

Inventors:
Fleece, manfred
Yank Tseek, Cheese
Application Number:
JP53217997A
Publication Date:
September 29, 2004
Filing Date:
March 04, 1997
Export Citation:
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Assignee:
Siemens Aktiengesellschaft
International Classes:
B42D15/10; G06K19/077; (IPC1-7): G06K19/077; B42D15/10
Domestic Patent References:
JP852968A
JP1133797A
JP844840A
JP5275838A
JP180473U
Attorney, Agent or Firm:
Iwao Yamaguchi