Title:
位置合わせ方法および装置
Document Type and Number:
Japanese Patent JP3571874
Kind Code:
B2
More Like This:
JP3512404 | SYSTEM AND METHOD FOR VACUUM PROCESSING |
JPS6446948 | WAFER HOLDER |
WO/2019/152751 | INTERCHANGEABLE EDGE RINGS FOR STABILIZING WAFER PLACEMENT AND SYSTEM USING SAME |
Inventors:
Shin Takakura
Shigeyuki Uzawa
Shigeyuki Uzawa
Application Number:
JP17914297A
Publication Date:
September 29, 2004
Filing Date:
June 20, 1997
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L21/68; H01L21/027; (IPC1-7): H01L21/027; H01L21/68
Domestic Patent References:
JP9007929A | ||||
JP8097114A | ||||
JP7307269A | ||||
JP7037770A | ||||
JP6252027A | ||||
JP6232028A | ||||
JP6224103A |
Attorney, Agent or Firm:
Tetsuya Ito