Title:
印刷回路用積層板
Document Type and Number:
Japanese Patent JP3578476
Kind Code:
B2
Inventors:
Yozo Shioda
Keiju Yamamoto
Keiju Yamamoto
Application Number:
JP30207993A
Publication Date:
October 20, 2004
Filing Date:
December 01, 1993
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
B32B5/28; B32B17/04; B32B27/38; H05K1/03; (IPC1-7): H05K1/03; B32B5/28; B32B17/04
Domestic Patent References:
| JP2286238A | ||||
| JP5144980A |