Title:
マイクロデバイス製品製造システム
Document Type and Number:
Japanese Patent JP3587769
Kind Code:
B2
Abstract:
A circuit board manufacturing system is provided which includes a circuit board assembly line (30) with a feeder/programming/buffer system (50). The feeder/programming/buffer system (50) has a flexible feeder mechanism (55) for receiving unprogrammed devices in a number of different manners, a programming mechanism (70) for performing a programming operation on the unprogrammed devices at a high rate of speed, and an output buffer mechanism (75) for providing the programmed devices to the circuit board assembly line (30).
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Inventors:
Rev. M. Bolotin
Application Number:
JP2000219105A
Publication Date:
November 10, 2004
Filing Date:
July 19, 2000
Export Citation:
Assignee:
DATA I/O CORPORATION
International Classes:
G05B19/418; G11C17/00; H05K13/00; B23P21/00; H05K13/04; H05K13/08; (IPC1-7): B23P21/00; G11C17/00; H05K13/00
Domestic Patent References:
| JP58056388A | ||||
| JP10249650A | ||||
| JP3205215A | ||||
| JP63293812A | ||||
| JP2001053499A | ||||
| JP11083943A | ||||
| JP7193111A | ||||
| JP11083943A | ||||
| JP641199A |
Foreign References:
| DE19801978A1 |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Hidehiko Ito
Yutaka Horii
Morishita Hachiro
Toshio Morita
Yoshihei Nakamura
Hidehiko Ito
Yutaka Horii
Morishita Hachiro