Title:
半導体装置
Document Type and Number:
Japanese Patent JP3588671
Kind Code:
B2
Inventors:
Tetsuya Hayashi
Yoshinori Murakami
Yoshinori Murakami
Application Number:
JP21752398A
Publication Date:
November 17, 2004
Filing Date:
July 31, 1998
Export Citation:
Assignee:
Nissan Motor Co., Ltd
International Classes:
H01L29/80; H01L29/06; H01L29/78; (IPC1-7): H01L29/80; H01L29/78
Domestic Patent References:
| JP9321292A | ||||
| JP9283754A |
Attorney, Agent or Firm:
Yoshihiko Izumi