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Title:
ガスおよびRF(無線周波数)出力を反応室に供給するための積重ねられたシャワヘッド組立体
Document Type and Number:
Japanese Patent JP3597871
Kind Code:
B2
Abstract:
A reaction chamber for chemical vapor deposition of a material layer onto a substrate using a process gas comprises a chamber body having an inner wall which defines a process space for containing a substrate, a lid to effectively close the process space, and a planar showerhead positioned inside the chamber body for dispersing a process gas into the process space. A lower insulator plate is positioned on one side of the showerhead between the showerhead and the chamber body for electrically insulating the showerhead from the chamber body, and an upper insulator plate is positioned on the other side of the showerhead between the showerhead and the chamber body and lid for electrically insulating the showerhead from the chamber body and lid. A shelf is formed in the inner wall of the chamber body, and the planar showerhead and upper and lower insulator plates are arranged in a stacked formation and are positioned on the shelf proximate the process space for introducing a process gas to a substrate in the process space.

Inventors:
Hillman, Joseph, Tee
Application Number:
JP55181699A
Publication Date:
December 08, 2004
Filing Date:
April 08, 1999
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
C23C16/505; C23C16/455; C23C16/509; H01L21/205; H01L21/28; H01L21/285; C23C16/44; (IPC1-7): C23C16/505; C23C16/455; H01L21/205; H01L21/285
Domestic Patent References:
JP9190980A
JP8035067A
JP9129627A
JP8031817A
JP7321054A
JP7216589A
Attorney, Agent or Firm:
Hideto Asamura
Hajime Asamura
Takakazu Yamamoto
Yukio Iwamoto