Title:
一般式;BNで示され、六方晶系5H型ないしは6H型多形構造を有し、紫外域で発光するsp3結合型窒化ホウ素とその製造方法、及びこれを利用した機能性材料
Document Type and Number:
Japanese Patent JP3598381
Kind Code:
B2
Abstract:
Boron nitride is a material having been mainly used for industrial applications as heat resistant and abrasion-resistant materials. Currently known sp3-bonded BNs are of cubic phase (3C polytypic form) and wurtzite form (2H polytypic form). The present invention provides a sp3-bonded boron nitride, represented by a general formula BN, having a hexagonal 5H or 6H polytypic form and having a property of emitting light in ultraviolet region. Its producing method comprises: introducing reaction mixed gas containing boron and nitrogen being diluted with dilution gas into a reaction chamber; and irradiating a surface of a substrate placed in the chamber, a growing surface on the substrate, and a growing spacing region about the growing surface with ultraviolet light to cause gas phase reaction, thereby generating, depositing, or growing the boron nitride on the substrate. Since the sp3-bonded hexagonal BN of 5H or 6H type has sharp emission at ultraviolet wavelength of 225 nm which is in a range capable of being used in atmosphere but almost borders on a region of vacuum ultraviolet, the BN has great potential as materials for practical application of solid ultraviolet laser. The practical application of solid ultraviolet laser will make immeasurable technical spillover effects on dramatic increase in capacity of rewritable recording media, chemistry, medicine, electronics industry, and others.
Inventors:
Shojiro Komatsu
Katsuyuki Okada
Yusuke Moriyoshi
Katsuyuki Okada
Yusuke Moriyoshi
Application Number:
JP2002192863A
Publication Date:
December 08, 2004
Filing Date:
July 02, 2002
Export Citation:
Assignee:
National Institute for Materials Science
International Classes:
C01B21/064; C09K11/08; C09K11/63; C23C14/00; C23C14/06; C23C14/28; C23C16/34; C23C16/38; C23C16/48; C23C16/50; C23C16/513; H01L33/30; H01L33/44; (IPC1-7): C01B21/064; C23C14/06; C23C14/28; C23C16/38; C23C16/48; H01L33/00
Domestic Patent References:
| JP6316402A | ||||
| JP5004808A |