Title:
化学的・機械的な研磨方法及びその装置並びに半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3610676
Kind Code:
B2
Inventors:
Tetsuo Okawa
Takashi Nishiguchi
Hidemi Sato
Hiroyuki Kojima
Mariko Urushihara
Takashi Nishiguchi
Hidemi Sato
Hiroyuki Kojima
Mariko Urushihara
Application Number:
JP14890496A
Publication Date:
January 19, 2005
Filing Date:
June 11, 1996
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B24B37/005; B24B37/04; B24B37/20; B24B37/24; B24B37/30; B24B37/32; B24B53/017; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Domestic Patent References:
| JP8148453A | ||||
| JP9007983A |
Attorney, Agent or Firm:
Yasuo Sakuta