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Patent Searching and Data


Title:
厚膜抵抗体ペースト
Document Type and Number:
Japanese Patent JP3611160
Kind Code:
B2
Abstract:
A thick-film resistor paste consists of a first glass powder, a second glass powder, a conductive material powder, and an organic vehicle. A quantity of the first glass powder mixed is larger than a quantity of the second glass powder mixed. The first glass powder contains, in total, 95 percentage by weight or above of CaO of 20 to 26 percentage by weight, SiO2 of 37 to 59 percentage by weight, Al2O3 of 5 to 13 percentage by weight and B2O3 of 8 to 28 percentage by weight. The second glass powder contains, in total, 85 percentage by weight or above of SiO2 of 53 to 72 percentage by weight, B2O3 of 20 to 30 percentage by weight and Na2O of 1 to 7 percentage by weight. The thermal expansion coefficient of the first glass powder is larger by 0.5x10<-6>/deg or above than the thermal expansion coefficient of the second glass powder. A glass transition point of the first glass powder is higher by 30 degrees Celsius or above than a glass transition point of the second glass powder.

Inventors:
Masashi Fukaya
Tomoko Matsuo
Chiaki Higuchi
Yoshinobu Watanabe
Application Number:
JP2622097A
Publication Date:
January 19, 2005
Filing Date:
February 10, 1997
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
Tanaka Kikinzoku Kogyo Co., Ltd.
International Classes:
H01C7/00; H01C17/065; H05K3/12; H05K1/16; (IPC1-7): H05K1/16; H05K3/12
Domestic Patent References:
JP4196105A
JP4196104A
JP8253342A
JP5175005A
JP6349314A
JP2292801A
JP9142879A
JP8153415A
JP7070362A
JP7302510A
Attorney, Agent or Firm:
Muneo Kako