Title:
テープキャリアパッケージコネクタ及びそれを使用した半導体装置、ならびにテープキャリアパッケージの実装方法
Document Type and Number:
Japanese Patent JP3613308
Kind Code:
B2
Inventors:
Satoru Watanabe
Application Number:
JP2711097A
Publication Date:
January 26, 2005
Filing Date:
February 10, 1997
Export Citation:
Assignee:
Nippon Crimp Terminal Manufacturing Co., Ltd.
International Classes:
H01L21/60; H01L23/52; H01R9/00; H05K3/36; (IPC1-7): H01L21/60; H01L23/52
Domestic Patent References:
| JP4229692A | ||||
| JP6326151A | ||||
| JP8088244A |
Attorney, Agent or Firm:
Masayuki Masabayashi