Title:
基板の処理方法及び処理装置
Document Type and Number:
Japanese Patent JP3616732
Kind Code:
B2
Abstract:
After a first processing solution is spread over the front surface of a substrate and the temperature of the front surface of the substrate is regulated at a predetermined substrate temperature, a second processing solution is spread over the front surface of the substrate. The second processing solution can be spread while the front surface temperature of the substrate is maintained at the predetermined substrate temperature. Hence, a layer insulating film with good adhesion properties can be formed uniformly on the front surface of the substrate, and the quantity of the processing solution to be used can be reduced.
Inventors:
Shinji Nagashima
Application Number:
JP19367199A
Publication Date:
February 02, 2005
Filing Date:
July 07, 1999
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; G03F7/16; H01L21/00; H01L21/312; H01L21/3213; (IPC1-7): H01L21/312; G03F7/16; H01L21/027
Domestic Patent References:
| JP2000150339A | ||||
| JP62211643A | ||||
| JP11169774A | ||||
| JP10303107A | ||||
| JP10247624A | ||||
| JP8083745A | ||||
| JP5315741A | ||||
| JP4354559A | ||||
| JP4098824A |
Attorney, Agent or Firm:
Koji Hagiwara
Tetsuo Kanamoto
Miaki Kametani
Tetsuo Kanamoto
Miaki Kametani