Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3619752
Kind Code:
B2
Inventors:
Kinoshita Mitsuru
Satoshi Otaka
Application Number:
JP2000177439A
Publication Date:
February 16, 2005
Filing Date:
June 13, 2000
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Renesas Technology Corp.
Renesas Northern Japan Semiconductor Co., Ltd.
International Classes:
H01L23/12; H01L21/60; (IPC1-7): H01L21/60; H01L23/12
Domestic Patent References:
JP9008172A
JP2000517104A
JP8046077A
JP64073625A
Attorney, Agent or Firm:
Yamato Tsutsui



 
Previous Patent: 断路器

Next Patent: 移動体の後方視界表示装置