Title:
集積回路構造体および集積回路構造体の製造方法
Document Type and Number:
Japanese Patent JP3637056
Kind Code:
B2
Abstract:
A new class of electronic systems, wherein microelectronic semiconductor integrated circuit devices are integrated on a common substrate with molecular electronic devices.
Inventors:
Mark a lead
James M Tua
James M Tua
Application Number:
JP50082894A
Publication Date:
April 06, 2005
Filing Date:
June 01, 1993
Export Citation:
Assignee:
Yale University
University of South Carolina
University of South Carolina
International Classes:
G11C13/02; H01L21/283; H01L21/3205; H01L51/05; H01L23/52; H01L27/02; H01L27/15; H01L27/28; H01L29/06; H01L29/66; H01L29/76; H01L29/88; H01L51/00; H01L51/30; H03K17/84; (IPC1-7): H01L27/15; H01L21/3205; H01L51/00
Domestic Patent References:
| JP61500195A | ||||
| JP5848942A | ||||
| JP6314472A |
Foreign References:
| US4427840 |
Attorney, Agent or Firm:
Keishiro Takahashi