Title:
上面にハンドルを有する目的物を掴むロボット方式の掴みデバイス
Document Type and Number:
Japanese Patent JP3806305
Kind Code:
B2
Abstract:
A wafer pod handling device engages a pod for transport through a flange on top of the pod by receiving the flange into a receptacle and rotating a circular disk having a square aperture such that edges on the disk are positioned beneath an overhang on the flange. As the circular disk is lifted, the edges contact the overhang of the flange and lift the pod. The circular disk is mounted in a housing having a lip adapted to slideably engage the circumference of the circular disk. An actuator on top of the housing rotates the disk into engagement with the flange. As the housing is lifted, the circumference of the circular disk rests on the lip to frictionally secure and support the circular disk despite power failures or accidental rotation that could disengage the pod.
Inventors:
Friedman, Gerald, M.
Application Number:
JP2000599683A
Publication Date:
August 09, 2006
Filing Date:
February 17, 2000
Export Citation:
Assignee:
Brooks Automation Incorporated
International Classes:
B25J15/08; B25J15/00; B66C1/62; B65D85/86; B65G1/00; B66C1/66; B66C1/68; H01L21/673; H01L21/687
Domestic Patent References:
| JP48062307U | ||||
| JP2086594A | ||||
| JP2138881U | ||||
| JP10137661A | ||||
| JP10070185A | ||||
| JP7215655A | ||||
| JP11297786A | ||||
| JP57184999A | ||||
| JP63162183A |
Attorney, Agent or Firm:
Teruo Akimoto
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