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Patent Searching and Data


Title:
コンピュータ
Document Type and Number:
Japanese Patent JP3830169
Kind Code:
B2
Abstract:
A heat exchange apparatus for a computing device. A heat dissipating cable connector for the computing device includes a heat dissipation mechanism. The heat dissipation mechanism in the heat dissipating cable connector is removably thermally coupled to a heat transfer element which is configured to transfer heat from an electronic component to the heat dissipation mechanism.

Inventors:
Barsha Rakesh
Application Number:
JP54711898A
Publication Date:
October 04, 2006
Filing Date:
April 22, 1998
Export Citation:
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Assignee:
INTEL CORPORATION
International Classes:
H05K7/20; G06F1/20
Domestic Patent References:
JP9018179A
JP59175194A
JP8042983A
Attorney, Agent or Firm:
Masaki Yamakawa
Hiroro Kurokawa
Masayuki Konno
Osamu Nishiyama
Jiro Suzuki
Shigeki Yamakawa