Title:
ポリオレフィン樹脂組成物
Document Type and Number:
Japanese Patent JP3861057
Kind Code:
B2
Abstract:
The polyolefin resin composition of the present invention includes 100 parts by weight polypropylene, 5 to 45 parts by weight inorganic filler, and 2 to 20 parts by weight silicon-grafted polyethylene. The polyolefin resin composition of the present invention is useful as a material of construction for various kinds of housings for electronic appliances and automobile parts since the resin exhibits better scratch resistance, resin fluidity, and moldability than prior art polyolefin resin compositions while maintaining mechanical properties.
Inventors:
Kim, Suk-won
Kim, Yong-won
Kim, Yong-won
Application Number:
JP2002553418A
Publication Date:
December 20, 2006
Filing Date:
December 22, 2000
Export Citation:
Assignee:
Samsung General Chemicals Co.,Ltd.
International Classes:
C08L23/10; C08K3/00; C08L51/06
Domestic Patent References:
| JP64079249A | ||||
| JP51123252A | ||||
| JP4028732A | ||||
| JP2240145A | ||||
| JP2000191845A | ||||
| JP9165478A |
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Shinsuke Onuki
Tadashige Ito