Title:
実装情報収集装置、コネクタ及び実装情報収集方法
Document Type and Number:
Japanese Patent JP3907474
Kind Code:
B2
Abstract:
There are disclosed a mounting information-collecting device which is capable of collecting mounting information concerning mounted statuses of circuit boards with high accuracy and efficiency, as well as a connector and a mounting information-collecting method therefor. A light-emitting device emits an optical signal. A plurality of optical signal-processing elements each apply processing to the optical signal in a manner unique to a corresponding one of the circuit boards to thereby generate a processed optical signal. A mounting information-collecting device receives the processed optical signal and detects whether or not the processing has been applied, to thereby collect the mounting information.
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| JPS58127882 | 【考案の名称】高圧発生装置 |
Inventors:
Fumihiko Saito
Takahiro Hosokawa
Shinji Hiyama
Hiroshi Nakade
Takahiro Hosokawa
Shinji Hiyama
Hiroshi Nakade
Application Number:
JP2001508206A
Publication Date:
April 18, 2007
Filing Date:
July 01, 1999
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K7/14; G01J1/42; G02B6/34; G02B6/36; H05K13/08; G02B6/38; G02B6/43; H05K1/02; H05K1/14
Domestic Patent References:
| JP9214153A | ||||
| JP4239198A | ||||
| JP816700A | ||||
| JP10221267A | ||||
| JP4108222U |
Attorney, Agent or Firm:
Takeshi Hattori