Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
テープ送り装置およびそれを備えたボンディング装置
Document Type and Number:
Japanese Patent JP3907476
Kind Code:
B2
Inventors:
Makoto Ota
Ito Tadashi
Application Number:
JP2001572397A
Publication Date:
April 18, 2007
Filing Date:
March 29, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
B65H20/20
Domestic Patent References:
JP1167151A
JP56084557U
JP45013269B1
JP51140736A
JP11100154A
JP44023455Y1
JP63162758U
JP9315411A
JP1251730A
JP4020236U
Attorney, Agent or Firm:
Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Satoshi Nazuka
Hideyuki Mori
Hirohito Katsunuma
Kiyohiro Suzuki



 
Previous Patent: 不飽和化合物の重合用触媒

Next Patent: 風力装置